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Online tools
Applied thermal design is often about combining solutions
to several small problems.
These calculators are written as
Java-applets and may take some time to load.
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Categories
Air flow
Pressure drop in perforated plates.
Targeted for typical electronics cooling applications.
Unavailability caused by fan fails
Impact of the environment, speed control etc.
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Convection
Heat transfer coefficient for parallel plates.
Logarithmic mean and inlet heat transfer coefficient for air cooled
parallel plates. This page also has a rich selection of equations
that cover almost any parallel plate case.
Natural convection for single plates.
Heat dissipation and heat transfer coefficient for single plates
cooled by natural convection.
Natural convection between parallel plates.
Heat dissipation, heat transfer coefficient and velocity for isothermal
parallel plates cooled by natural convection.
Natural convection in an enclosure.
Thermal wall-to-wall properties for an enclosure filled with
air.
Thermal properties for air.
Thermal air properties as function of temperature and altitude.
Heat dissipation and efficiency for fins.
Heat dissipation and efficiency as function of air velocity and heat
transfer coefficient for rectangular, circular and cylindric fins.
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Conduction
Transient temperature distribution on a plate.
A 2-D analytical solution for the dynamic temperature
distribution on a convection cooled plate with discrete heat
sources. The solution is based on several nestled Fourier series.
Transient temperature distribution in a block.
A 3-D analytical solution for the dynamic temperature
distribution in a rectangular block with a discrete heat source
on one side and isothermal condition on the opposite side.
Thermal resistance for a bottle neck.
Thermal resistance for a rod with one isothermal end and
one end with a heat source.
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Heat sinks
Natural convection heat sink.
Temperature difference, heat dissipation and volumetric efficiency
for a natural convection cooled heat sink with an isothermal
bottom plate.
Forced convection heat sink.
Temperature difference, thermal resistance and pressure drop for a
heat sink in confined flow, (no bypass).
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Micro circuit cooling
Thermal resistance from pads to inner layers of a PCB.
Estimates the thermal resistance from pads to the first inner layer
for multi-layer PCBs. The theory is explained in the article
Thermal Component Models, part 4
Thermal territory for a component.
A thermal territory
for a component is defined as the smallest surface
of a PCB that a component needs for its cooling. This applet calculates
the size and the associated thermal efficiency.
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PCB cooling
Convection cooled plate with discrete heat sources.
A 3-D analytical solution for the temperature profile on a plate,
cooled by convection on one side and with discrete heat sources
on the other side. The algorithm is based on
a double Fourier series solution.
Edge cooled plate with discrete heat sources.
Temperature distribution on an edge-cooled plate with discrete heat
sources.
Maximum heat dissipation estimate for a
PCB.
Calculates the maximum heat dissipation that can be
put on a PCB. The criteria is the maximum PCB temperature
difference and a user estimate for the cooling efficiency.
Thermal properties for PCBs.
Thermal conductivity, density and specific heat for multi-layer PCBs.
Temperature distribution on a forced
convection cooled PCB.
2-D temperature profile on a convection cooled PCB with rectangular heat
sources. The algorithm is based on
Bessel functions and is extremely rapid.
The birth of the
cooling efficiency
A Java animation that hopefully can provide a few minutes
relaxation.
Be patient if you have a slow connection. It is 200 Kbyte code.
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Thermal radiation
Radiation between parallel plates.
Heat exchange, angle factor and heat transfer coefficient between two
parallel isothermal surfaces.
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Various
Interleaved fin connector.
Thermal resistance for interleaved fin connectors.
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