Thermal Resistance from Pads to Inner Layers


Online calculator for the thermal resistance between pads and the first inner layer of a PCB.

The article Thermal Component Models, part 4 explains the theory depth.

Related links
Thermal design for electronics
Thermal online tools
Unit conversion
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Inputs

Pads
There thermal resistance for the pads are calculated with the 45-deg rule. The flow channel for a single pad resembles a cut pyramid. In the case of various row and arrays arrangements the pyramid-like flow channels are cut so that no overlapping occurs.

Signal lines
Signal lines connected to pads give a small contribution to the conduction. This impact ceases after a couple of millimeters of distance. The critical length is a measure of that distance.

Ground connections
Since signal lines are poor conductors ground connections only contribute if they are placed near the pads. The number of ground connection count input should therefore be limited to those that are placed very near the pads.